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DP83924 Datasheet(PDF) 19 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # DP83924
Description  Quad 10 Mb/s Ethernet Physical Layer - 4TPHY?
PDF  42 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

DP83924 Datasheet(HTML) 19 Page - National Semiconductor (TI)

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3.0 Detailed Functional Description (Continued)
19
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3.5.23 ID_Code Instruction
The ID_Code instruction allows users to select the 32-bit
IDCODE register and interrogate the contents which
consist of the manufacturer's ID, part ID and the version
number. For DP83924B the ID code register holds the
value h’1800801F.
3.5.24 Bypass Instruction
The bypass instruction uses the bypass register. The
bypass register contains a single shift-register stage and is
used to provide a minimum length serial path between the
TDI and TDO pins of the DP83924B when test operation is
not required. This allows more rapid movement of test data
to and from other testable devices in the system.
3.5.25 Sample/Preload Instruction
The Sample/Preload instruction allows scanning of the
boundary-scan register without causing interference to the
normal operation of the on-chip system logic.
Two functions are performed when this instruction is
selected.
Sample allows a snapshot to be taken of the data flowing
from the system pins to the on-chip test logic or vice versa,
without interfering with normal operation. The snapshot is
taken on the rising edge of TCK in the Capture-DR
controller state, and the data can be viewed by shifting
through the component's TDO output.
While sampling and shifting data out through TDO for
observation, preload allows an initial data pattern to be
shifted in through TDI and to be placed at the latched
parallel output of the boundary-scan register cells which
are connected to system output pins. This ensures that
known data is driven through the system output pins upon
entering the Extest instruction.
Without Preload, indeterminate data would be driven until
the first scan sequence has been completed. The shifting
of data for the Sample and Preload phases can occur
simultaneously. While data capture is being shifted out, the
preload data can be shifted in.
3.5.26 Extest Instruction
The Extest instruction allows circuitry external to the
DP83924B (typically the board interconnections) to be
tested.
Prior to executing the Extest instruction, the first test
stimulus to be applied will be shifted into the boundary-
scan registers using the Sample/Preload instruction. Thus,
when the change to the Extest instruction takes place,
known data will be driven immediately from the DP83924B
to its external connections.
This provides stimulus to the system input pins of adjacent
devices on the assembled printed circuit board s. Figure12
below illustrates the IEEE 1149.1 architecture.
3.5.27 Device Testing
IEEE 1149.1 provides a simple solution for testing many of
the standard static pin parametrics. Reasonably accurate
limits may be tested as a functional pattern.
The IEEE 1149.1 test circuitry is tested itself as a
consequence of testing pin parametrics. Specific tests are:
TRI-STATE® conditions of TDO when serial shift
between TDI and TDO is not selected
Input leakage of TCK, TMS, TDI and TRST
Output has TRI-STATE leakage of TDO
Opens and shorts of TCK, TMS, TDI,TRST, and TDO
IDCODE register, the bypass registerand the TAP
controller state machine sequences
Open and shorted pins can be identified by placing an
alternating bit pattern on the I/O pins. Any shorted bond
wires would either cause an input to be misinterpreted in
the inputs scan phase, or the test comparator would fail an
output during data scan.
Repeating the test with the inverse bit pattern provides
coverage of VCC and GND short/open circuits.
3.5.28 Boundary Scan Description Language File
A Boundary Scan Description Language (BSDL) file is
available. Contact your local National Semiconductor
representative to obtain the latest version.



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