AD5770R datasheet(9/59 Pages) AD

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Data Sheet

AD5770R

Rev. 0 | Page 9 of 59

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted

Table 5.

Parameter

Rating

AVDD to DVDD

−0.3 V to +0.3 V

AVDD to AGND

−0.3 V to +6.5 V

AVDD to PVDDx

−0.3 V to +6.5 V

AVDD to AVEE

−0.3 V to +10 V

AVEE to AGND

+0.3 V to −3.5 V

PVEE0 to AGND

+0.3 V to −3.5 V

AVEE to PVEE0

−3 .0 V to +0.3 V

PVDDx to AGND

−0.3 V to +6.5 V

PVDDx to AVEE

−0.3 V to +8.5 V

AVDD to PVEE0

−0.3 V to +6.5 V

VREF_IO to AGND

−0.3 V to AVDD + 0.3 V

IDAC0 to PVEE0

−0.3 V to +6.5 V

IDAC1 through IDAC5 to AGND

−0.3 V to PVDDx + 0.3 V

DVDD to DGND

−0.3 V to +6.5 V

IOVDD to DGND

−0.3 V to +6.5 V

REFGND to AGND

−0.3 V to +0.3 V

AGND to DGND

−0.3 V to +0.3 V

Digital Inputs to DGND1

−0.3 V to IOVDD + 0.3 V

Digital Outputs to DGND2

−0.3 V to IOVDD + 0.3 V

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Maximum Junction Temperature, TJMAX

150°C

Power Dissipation

(TJMAX – TA)/θJA

Lead Temperature, Soldering Reflow

260°C, as per JEDEC

J-STD-020

Digital inputs include SCLK, SDI, RESET, and LDAC.

Digital outputs include SDO and ALARME

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

Table 6. Thermal Resistance

Package Type

θJA

Unit

CB-49-5

301

°C/W

Thermal impedance simulated values are based on JEDEC 2S2P thermal test

board with 16 thermal vias. See JEDEC JESD51.

19B

ESD CAUTION

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