LM60430 datasheet(6/38 Pages) TI

6 / 38 page

LM60440, LM60430

SNVSBN5A – FEBRUARY 2020 – REVISED JUNE 2020

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Product Folder Links: LM60440 LM60430

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These

values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the

performance obtained in an actual application.

7.4 Thermal Information

The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design

purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do

not represent the performance obtained in an actual application.

THERMAL METRIC(1)(2)

LM60440/LM60430

UNIT

WQFN

13 PINS

RθJA

Junction-to-ambient thermal resistance

54(2)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

37.8

°C/W

RθJB

Junction-to-board thermal resistance

15.3

°C/W

ψJT

Junction-to-top characterization parameter

0.8

°C/W

ψJB

Junction-to-board characterization parameter

15.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

24.2

°C/W

(1)

This is the current used by the device open loop. It does not represent the total input current of the system when in regulation.

(2)

When the voltage across the CBOOT capacitor falls below this voltage, the low side MOSFET is turned on to recharge CBOOT.

(3)

The current limit values in this table are tested, open loop, in production. They may differ from those found in a closed loop application.

7.5 Electrical Characteristics

Limits apply over the operating junction temperature (TJ) range of –40°C to +150°C, unless otherwise stated. Minimum and

maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric

norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply: VIN

= 12 V, VEN = 4 V.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY VOLTAGE

VIN

Minimum operating input

voltage

3.8

Non-switching input current;

measured at VIN pin (1)

VFB = 1.2 V

µA

ISD

Shutdown quiescent current;

measured at VIN pin

EN = 0

µA

ENABLE

VEN-VCC-H

EN input level required to turn

on internal LDO

Rising threshold

VEN-VCC-L

EN input level required to turn

off internal LDO

Falling threshold

0.3

VEN-H

EN input level required to

start switching

Rising threshold

1.2

1.231

1.26

VEN-HYS

Hysteresis below VEN-H

Hysteresis below VEN-H; falling

100

ILKG-EN

Enable input leakage current

VEN = 3.3 V

0.2

INTERNAL SUPPLIES

VCC

Internal LDO output voltage

appearing at the VCC pin

6 V

≤ VIN ≤ 36 V

4.75

5.25

VBOOT-UVLO

Bootstrap voltage

undervoltage lock-out

threshold(2)

2.2

VOLTAGE REFERENCE (FB PIN)

VFB

Feedback voltage

0.985

1.015

IFB

Current into FB pin

FB = 1 V

0.2

CURRENT LIMITS(3)

ISC

High-side current limit

LM60440

4.7

5.5

ISC

High-side current limit

LM60430

3.85

4.5

5.05

ILIMIT

Low-side current limit

LM60440

4.5

4.9

ILIMIT

Low-side current limit

LM60430

2.9

3.5

4.1

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