MPC5673K datasheet(73/147 Pages) NXP

73 / 147 page

Electrical characteristics

MPC5675K Microcontroller Data Sheet, Rev. 8.1

NXP Semiconductors

RθJA =RθJC + RθCA

Eqn. 2

where:

RθJA

= junction to ambient thermal resistance (°C/W)

RθJC

= junction to case thermal resistance (°C/W)

RθCA = case to ambient thermal resistance (°C/W)

RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to

ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the

interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit

board surrounding the device.

To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal

Characterization Parameter (

ΨJT) can be used to determine the junction temperature with a measurement of the temperature at

the top center of the package case using Equation 3:

TJ =TT +(ΨJT ×PD)

Eqn. 3

where:

= thermocouple temperature on top of the package (°C)

ΨJT

= thermal characterization parameter (°C/W)

= power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied

to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the

package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the

junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects

of the thermocouple wire.

See [6] to [10] in Section 6, Reference documents, for more information.

3.5

Electromagnetic interference (EMI) characteristics

3.5.1

Test Setup

Electromagnetic emission tests are performed by TEM cell [2] and via direct coupling [3] (150

Ω) measurements.

Electromagnetic immunity is measured by DPI [4].

See Section 6, Reference documents, for more information.

3.5.2

Test parameters

The following test parameters shall be used:

Table 14. EMC test parameters

Method

Frequency Range

Receiver

Step Size

150

1 MHz to 1000 MHz

1 MHz

500 kHz

TEM

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