MPC5673K datasheet(92/147 Pages) NXP

92 / 147 page

MPC5675K Microcontroller Data Sheet, Rev. 8.1

Electrical characteristics

NXP Semiconductors

3.18.1

PDI pad current specifications

The power consumption of an I/O segment is dependent on the usage of the pins on a particular segment. The power

consumption is the sum of all output pin currents for a particular segment. The output pin current can be calculated based on

the voltage, frequency, and load on the pin.

3.18.2

Power Sequence Pin States for PDI Pads

PDI Fast

0.8/0.7

--------

1.1/1.08

10/10

1.1/1.1

—

15/15

2.6/2.6

200

15/15

2.4/2.4

22/22

5/5

200

24/24

5/5

33/33

8/8

200

66/66

16/16

84/84

21/21

200

→ H signifies low-to-high propagation delay and H → L signifies high-to-low propagation delay.

Table 41. PDI pad current specifications

Pad Type

Frequency

(MHz)

Load

(pF)

Voltage

(V)

Drive/Slew Rate

Select

Current

(mA)

PDI Medium

3.6

8.7

3.6

3.8

3.6

2.3

3.6

0.38

3200

3.6

1.5

PDI Fast

3.6

6.2

3.6

4.0

3.6

2.4

200

3.6

8.9

Table 42. Power sequence pin states for PDI pads

VDD_LV_COR

VDD_HV_IO

VDD_HV_PDI

Pad Function

Low

High

Outputs drive high

Table 40. PDI pads AC electrical characteristics (continued)

No.

Name

Prop. Delay (ns)

→ H/H → L1

Rise/Fall Edge

(ns)

Drive Load

(pF)

Drive/Slew

Rate Select

MinMax

MSB, LSB

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