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SC3200 Datasheet(PDF) 441 Page - Advanced Micro Devices |
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SC3200 Datasheet(HTML) 441 Page - Advanced Micro Devices |
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441 / 447 page ![]() AMD Geode™ SC3200 Processor Data Book 441 Package Specifications Revision 5.1 10.2 Physical Dimensions The figures in this section provide the mechanical package outlines for the 432-Terminal EBGA (Enhanced Ball Grid Array) and 481-Terminal TEPBGA (Thermally Enhanced Ball Grid Array) packages. Figure 10-2. 432-Terminal EBGA Package (Body Size: 40x40x1.72 mm; Pitch: 1.27 mm) NOTES: UNLESS OTHERWISE SPECIFIED. 1) EBGA WITH LEAD (PB): a) SOLDER BALL COMPOSITION: SN 63%, PB 37%. b) SOLDERING PROFILE: 220o C. 2) EBGA LEAD (PB) FREE: a) SOLDER BALL COMPOSITION: SN 96.5%, AG 3.5%. b) SOLDERING PROFILE: 260o C 3) DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N. 4) REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.00, DATED JUNE 1997. 5) THETA JUNCTION TO CASE (TJC) = 1°C/WATT. |
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