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SC3200 Datasheet(PDF) 442 Page - Advanced Micro Devices

Part # SC3200
Description  AMD GEODE-TM SC3200 PROCESSOR
PDF  447 Pages
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Manufacturer  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

SC3200 Datasheet(HTML) 442 Page - Advanced Micro Devices

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AMD Geode™ SC3200 Processor Data Book
Package Specifications
Revision 5.1
Figure 10-3. 481-Terminal TEPBGA Package (Body Size: 40x40x2.38 mm; Pitch: 1.27 mm)
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
TEPBGA WITH LEAD (PB):
a) SOLDER BALL COMPOSITION: SN 63%, PB 37%.
b) SOLDERING PROFILE: 220o C.
2)
TEPBGA LEAD (PB) FREE:
a) SOLDER BALL COMPOSITION: SN 96.5%, AG 3.5%.
b) SOLDERING PROFILE: 260o C
3)
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
4)
THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION.
5)
REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAU-1.
6)
THETA JUNCTION TO CASE (TJC) = 5°C/WATT.



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