ECE1200 datasheet(15/87 Pages) MICROCHIP

15 / 87 page

 2018-2021 Microchip Technology Inc.

DS00003093C Draft-page 15

ECE1200

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

2.80

MILLIMETERS

0.40 BSC

MIN

MAX

4.90

Contact Pad Length (X40)

Contact Pad Width (X40)

0.90

0.20

NOM

Contact Pad Spacing

4.90

Contact Pad to Center Pad (X40)

0.60

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Contact Pad (X36)

0.20

ØV

SILK SCREEN

Microchip Technology Drawing C04-2496 Rev A

40-Lead Very Thin Plastic Quad Flat, No Lead Package (LDX) - 5x5 mm Body [VQFN]

With 2.7x2.7 mm Exposed Pad

ECE1200 Datasheet(PDF) 15 Page - Microchip Technology

ECE1200 Datasheet(HTML) 15 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87

Datasheet Download

Link URL