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FS6407 Datasheet(PDF) 9 Page - NXP Semiconductors |
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FS6407 Datasheet(HTML) 9 Page - NXP Semiconductors |
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9 / 111 page  NXP Semiconductors 9 FS6407/FS6408 VESD-HBM1 VESD-HBM2 VESD-HBM3 VESD-CDM1 VESD-CDM2 VESD-GUN1 VESD-GUN2 VESD-GUN3 VESD-GUN4 VESD-GUN5 VESD-GUN6 VESD-GUN7 VESD-GUN8 ESD Voltage Human Body Model (JESD22/A114) - 100 pF, 1.5 k Ω • All pins (ESD Class 2) • VSUP1,VSUP2, VSUP3, VSENSE, VAUX, IO_0:1, IO_4:5,FS0B, DEBUG (ESD Class 3A) • CANH, CANL (ESD Class 3A) Charge Device Model (JESD22/C101): • All Pins (ESD Class 2) • Corner Pins (ESD Class 2) System level ESD (Gun Test) • VSUP1, VSUP2, VSUP3, VSENSE, VAUX, IO_0:1, IO_4:5, FS0B 330 Ω / 150 pF Unpowered According to IEC61000-4-2: 330 Ω / 150 pF Unpowered According to OEM CAN, FLexray Conformance 2.0 k Ω / 150 pF Unpowered According to ISO10605.2008 2.0 k Ω / 330 pF Powered According to ISO10605.2008 • CANH, CANL 330 Ω / 150 pF Unpowered According to IEC61000-4-2: 330 Ω / 150 pF Unpowered According to OEM CAN, FLexray Conformance 2.0 k Ω / 150 pF Unpowered According to ISO10605.2008 2.0 k Ω / 330 pF Powered According to ISO10605.2008 ±2.0 ±4.0 ±6.0 ±500 ±750 ±8.0 ±8.0 ±8.0 ±8.0 ±15.0 ±12.0 ±15.0 ±15.0 kV kV kV V V kV kV kV kV kV kV kV kV (3) Thermal ratings TA Ambient Temperature -40 to 125 °C TJ Junction Temperature -40 to 150 °C TSTG Storage Temperature -55 to 150 °C Thermal resistance RθJA Thermal Resistance Junction to Ambient 30 °C/W (4) RθJCTOP Thermal Resistance Junction to Case Top 24.2 °C/W (5) RθJCBOTTOM Thermal Resistance Junction to Case Bottom 0.9 °C/W (6) Notes 3. Compared to AGND. 4. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC - 883 Method 1012.1). 6. Thermal resistance between the die and the solder par on the bottom of the packaged based on simulation without any interface resistance. Table 3. Maximum ratings (continued) All voltages are with respect to ground, unless otherwise specified. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Ratings Value Unit Notes |
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