AP72202

Document number: DS46304 Rev. 1 - 2

4 of 30

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May 2024

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AP72202

Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Rating

Unit

VIN, PVIN

Supply Voltage

-0.3 to 7.0

V

VOUT

Output Voltage

-0.3 to 6.0

V

VSW1, VSW2

Switch Node Voltage

-1.0 to 7.0 (DC)

V

VSW1, VSW2

Switch Node Voltage

-2.5 to 8.0 (20ns)

V

VIO

I2C Voltage

-1.0 to 7.0

V

All Other Pins

—

-0.3 to 7.0

V

TJ

Junction Temperature

+150

°C

TL

Lead Temperature

+260

°C

ESD Susceptibility (Note 5)

—

—

—

HBM

Human Body Model

3000

V

CDM

Charged Device Model

1000

V

Notes:

4. Stresses greater than the Absolute Maximum Ratings specified above can cause permanent damage to the device. These are stress ratings only;

functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability can be

affected by exposure to absolute maximum rating conditions for extended periods of time.

5. Semiconductor devices are ESD sensitive and can be damaged by exposure to ESD events. Suitable ESD precautions should be taken when

handling and transporting these devices.

Thermal Resistance (Note 6)

Symbol

Parameter

Rating

Unit

θJA

Junction to Ambient

2.125 × 1.750mm

50

°C/W

θJC

Junction to Case

2.125 × 1.750mm

2

°C/W

Note:

6. Test condition for WLCSP: Device mounted on FR-4 substrate, four-layer PC board, 2oz copper, with minimum recommended pad layout

Recommended Operating Conditions (Note 7) (@TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Min

Max

Unit

PVIN

Supply Voltage

2.3

5.5

V

TA

Operating Ambient Temperature Range

-30

+85

°C

Note:

7. The device function is not guaranteed outside of the recommended operating conditions.