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TLC6989 Datasheet(PDF) 4 Page - Texas Instruments

Part # TLC6989
Description  TLC6989 SPI-Compatible Connectivity for TLC698x Device Family
PDF  72 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLC6989 Datasheet(HTML) 4 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Voltage on pins
VCC
–0.3
6
V
SDI, SCLK, CS, SIN
–0.3
VCC + 0.3
V
SDO, DRDY, SOUT, CLK_O
–0.3
VCC + 0.3
V
FAULT
–0.3
6
V
TJ
Junction temperature
–40
150
°C
Tstg
Storage temperature
–55
150
°C
(1)
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001 (1)
±4000
V
Charged-device model (CDM), per ANSI/ESDA/
JEDEC JS-002 (2)
±1000
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
6.3 Thermal Information
THERMAL METRIC(1)
DRR (SON)
DYY (SOT)
UNIT
12 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
66.6
127.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
57.1
58.9
°C/W
RθJB
Junction-to-board thermal resistance
37.1
54.6
°C/W
ΨJT
Junction-to-top characterization parameter
2.3
3.2
°C/W
ΨJB
Junction-to-board characterization parameter
36.9
54.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
12.7
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2.5
5.5
V
Voltage on pins
SDI, SCLK, CS, SIN
0
VCC
V
SDO, DRDY, SOUT, CLK_O
0
VCC
V
FAULT
0
VCC
V
fSCLK
SPI clock frequency
20
MHz
CVCC
VCC decoupling capacitor
100
nF
TA
Ambient temperature
–40
85
°C
TLC6989
SLVSHF5 – NOVEMBER 2024
www.ti.com
4
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TLC6989



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