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TLC6989 Datasheet(PDF) 66 Page - Texas Instruments |
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TLC6989 Datasheet(HTML) 66 Page - Texas Instruments |
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66 / 72 page ![]() www.ti.com PACKAGE OUTLINE C 3.1 2.9 3.1 2.9 0.8 0.6 0.05 0.00 2X 2.5 10X 0.5 12X 0.52 0.32 12X 0.3 0.2 2.5 0.1 1.3 0.1 (0.1) TYP (0.43) TYP WSON - 0.8 mm max height DRR0012G PLASTIC SMALL OUTLINE - NO LEAD 4227052/A 08/2021 0.08 C 0.1 C A B 0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID (45 X 0.3) SYMM EXPOSED THERMAL PAD SYMM 1 6 7 12 13 SCALE 4.000 A B |
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