PCIMX258CJM4A datasheet(1/144 Pages) FREESCALE

Part #	PCIMX258CJM4A

Description	i.MX25 Applications Processor for Consumer and Industrial Products

PDF	144 Pages

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX25CEC

Rev. 3, 04/2010

MCIMX25

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

Case 2107 12 x 12 mm, 0.5 mm Pitch

Ordering Information

See Table 1 on page 3 for ordering information.

1

Introduction

The i.MX25 multimedia applications processor has

the right mix of high performance, low power, and

integration to support the growing needs of the

industrial and general embedded markets.

At the core of the i.MX25 is Freescale's fast,

proven, power-efficient implementation of the

ARM926EJ-S core, with speeds of up to 400 MHz.

The i.MX25 includes support for up to 133-MHz

DDR2 memory, integrated 10/100 Ethernet MAC,

and two on-chip USB PHYs. The device is suitable

for a wide range of applications, including the

following:

•

Graphical remote controls

•

Human machine interface (HMI)

•

Residential and commercial control panels

•

Residential gateway (smart metering)

•

Handheld scanners and printers

i.MX25 Applications

Processor for Consumer

and Industrial Products

Silicon Version 1.1

1.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2.

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1.

Special Signal Considerations . . . . . . . . . . . . . . . . 9

3.

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1.

i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11

3.2.

Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3.

Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 17

3.4.

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18

3.5.

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19

3.6.

AC Electrical Characteristics . . . . . . . . . . . . . . . . 24

3.7.

Module Timing and Electrical Parameters . . . . . . 42

4.

Package Information and Contact Assignment . . . . . . 123

4.1.

400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 123

4.2.

Ground, Power, Sense, and Reference Contact

Assignments Case 17x17 mm, 0.8 mm Pitch . . . 124

4.3.

Signal Contact Assignments—17x17 mm,

0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

4.4.

i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 129

4.5.

347 MAPBGA—Case 12x12 mm,

0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

4.6.

Ground, Power, Sense, and Reference Contact

Assignments Case 12x12 mm, 0.5 mm Pitch . . . 133

4.7.

Signal Contact Assignments—12x12 mm,

0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

4.8.

i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 137

5.

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

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