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LPC4370 Datasheet(PDF) 150 Page - NXP Semiconductors |
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LPC4370 Datasheet(HTML) 150 Page - NXP Semiconductors |
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150 / 150 page ![]() NXP Semiconductors LPC4370 32-bit ARM Cortex-M4/M0 microcontroller © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 October 2013 Document identifier: LPC4370 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 7.23.2 System Control Unit (SCU). . . . . . . . . . . . . . . 79 7.23.3 Clock Generation Unit (CGU) . . . . . . . . . . . . . 80 7.23.4 Internal RC oscillator (IRC). . . . . . . . . . . . . . . 80 7.23.5 PLL0USB (for USB0) . . . . . . . . . . . . . . . . . . . 80 7.23.6 PLL0AUDIO (for audio) . . . . . . . . . . . . . . . . . 80 7.23.7 System PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.23.8 Reset Generation Unit (RGU). . . . . . . . . . . . . 81 7.23.9 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 81 7.23.9.1 Memory retention in Power-down modes . . . . 82 7.23.9.2 Power Management Controller (PMC) . . . . . . 83 7.24 Serial Wire Debug/JTAG. . . . . . . . . . . . . . . . . 84 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 85 9 Thermal characteristics . . . . . . . . . . . . . . . . . 86 10 Static characteristics . . . . . . . . . . . . . . . . . . . . 87 10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 94 10.2 Peripheral power consumption . . . . . . . . . . . . 98 10.3 BOD static characteristics. . . . . . . . . . . . . . . 100 10.4 Electrical pin characteristics . . . . . . . . . . . . . 101 11 Dynamic characteristics . . . . . . . . . . . . . . . . 105 11.1 Wake-up times . . . . . . . . . . . . . . . . . . . . . . . 105 11.2 External clock for oscillator in slave mode . . 105 11.3 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 106 11.4 IRC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 106 11.5 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 106 11.6 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 11.7 I2S-bus interface . . . . . . . . . . . . . . . . . . . . . . 108 11.8 USART interface. . . . . . . . . . . . . . . . . . . . . . 109 11.9 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . 110 11.10 SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . 111 11.11 SSP/SPI timing diagrams . . . . . . . . . . . . . . . 111 11.12 SPIFI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 11.13 SGPIO timing . . . . . . . . . . . . . . . . . . . . . . . . 113 11.14 External memory interface . . . . . . . . . . . . . . 115 11.15 USB interface . . . . . . . . . . . . . . . . . . . . . . . 120 11.16 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 11.17 SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 11.18 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 12 ADC/DAC electrical characteristics . . . . . . . 124 13 Application information. . . . . . . . . . . . . . . . . 128 13.1 LCD panel signal usage . . . . . . . . . . . . . . . . 128 13.2 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 130 13.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 132 13.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . . . . . . 132 13.5 Standard I/O pin configuration . . . . . . . . . . . 132 13.6 Reset pin configuration . . . . . . . . . . . . . . . . . 133 13.7 Minimizing interference between digital signals and 12-bit ADC signals. . . . . . . . . . . 134 13.8 12-bit ADCHS input selection . . . . . . . . . . . . 134 13.8.1 Inverting single-ended circuit . . . . . . . . . . . . 136 13.8.2 Non-inverting single-ended circuit with gain = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 13.8.3 Non-inverting single-ended circuit for input 0 V to 3.3 V . . . . . . . . . . . . . . . . . . . . . 138 14 Package outline. . . . . . . . . . . . . . . . . . . . . . . 139 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . 143 17 References. . . . . . . . . . . . . . . . . . . . . . . . . . . 144 18 Revision history . . . . . . . . . . . . . . . . . . . . . . 145 19 Legal information . . . . . . . . . . . . . . . . . . . . . 147 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 147 19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . 147 19.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . 147 19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . 148 20 Contact information . . . . . . . . . . . . . . . . . . . 148 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 |
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