A40MX02 datasheet(59/142 Pages) MICROSEMI

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40MX and 42MX FPGA Families

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CMOS Output Module Timing5

tDLH

Data-to-Pad HIGH

2.4

2.7

3.1

3.6

5.1

tDHL

Data-to-Pad LOW

2.9

3.2

3.6

4.3

6.0

tENZH

Enable Pad Z to HIGH

2.7

2.9

3.3

3.9

5.5

tENZL

Enable Pad Z to LOW

2.9

3.2

3.7

4.3

6.1

tENHZ

Enable Pad HIGH to Z

4.9

5.4

6.2

7.3

10.2

tENLZ

Enable Pad LOW to Z

5.3

5.9

6.7

7.9

11.1

tGLH

G-to-Pad HIGH

4.2

4.6

5.2

6.1

8.6

tGHL

G-to-Pad LOW

4.2

4.6

5.2

6.1

8.6

tLSU

I/O Latch Set-Up

0.5

0.6

0.7

1.0

tLH

I/O Latch Hold

0.0

tLCO

I/O Latch Clock-to-Out

(Pad-to-Pad), 64 Clock Loading

5.2

5.8

6.6

7.7

10.8

tACO

Array Clock-to-Out (

Pad-to-Pad), 64 Clock Loading

7.4

8.2

9.3

10.9

15.3

dTLH

Capacity Loading, LOW to HIGH

0.03

0.04

0.06 ns/pF

dTHL

Capacity Loading, HIGH to LOW

0.04

0.05

0.07 ns/pF

Table 1-32 • A42MX09 Timing Characteristics (Nominal 5.0 V Operation) (continued)

(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)

–3 Speed

–2 Speed

–1 Speed

Std Speed

–F Speed

Units

Parameter / Description

Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for

estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules

can be obtained from the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External

setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external

PAD signal to the G input subtracts (adds) to the internal setup (hold) time.

5. Delays based on 35 pF loading.

A40MX02 Datasheet(PDF) 59 Page - Microsemi Corporation

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