FXLS8964AF datasheet(86/98 Pages) NXP

86 / 98 page

NXP Semiconductors

FXLS8964AF

3-Axis Low-g Accelerometer

FXLS8964AF

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Objective data sheet

Rev. 2 — 30 October 2020

86 / 98

10X 0.25

0.15

10X 0.45

0.35

10X 0.400 Min1

2X 0.050 Typ2

2X 0.0375 Typ2

10X 0.425 Min

0.450 Typ

10X 0.825 Min1

0.850 Typ

10X 1.0

Package outline

8X 0.4

10X 0.200 Min

0.225 Typ

Package

Solder mask

PCB land pad

Package outline

PCB land pad

[1] PCB pad lengths exterior to the package edge should be at

least 0.4 mm long. If board space allows, a longer pad extension,

such as 0.6 mm will generally result in more consistent fillet

formation. This is because the inspectable solder fillet formation

will be influenced less by PCB assembly issues, such as misalignment.

[2] The solder mask clearance should be designed to be greater

than or equal to PCB vendor's solder mask registration.

Solder mask

opening

aaa-028908

Figure 25. PCB footprint guidelines

15 Package information

The FXLS8964AF uses a ten-pin DFN package, case number 98ASA00979D.

FXLS8964AF Datasheet(PDF) 86 Page - NXP Semiconductors

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