FXLS8964AF datasheet(90/98 Pages) NXP

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FXLS8964AF Datasheet(PDF) 90 Page - NXP Semiconductors

90 / 98 page

NXP Semiconductors

FXLS8964AF

3-Axis Low-g Accelerometer

FXLS8964AF

All information provided in this document is subject to legal disclaimers.

Objective data sheet

Rev. 2 — 30 October 2020

90 / 98

15.2 Lead dimension detail

The width of lead end as viewed from leaded side of package has minimum dimension of

0.125 mm. The maximum dimension is equal to lead width at the bottom surface of the

package as indicated on the drawing.

Figure 29. Bottom and leaded view dimensions

15.3 Burr specification

The assembly site specifies burrs to 0.076 mm maximum.

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