ATXP032 datasheet(111/113 Pages) DIALOG

111 / 113 page

Corporate Office

California | USA

Adesto Headquarters

3600 Peterson Way

Santa Clara, CA 95054

Phone: (+1) 408.400.0578

Email: contact@adestotech.com

Adesto, the Adesto logo, CBRAM and DataFlash are trademarks or registered trademarks of Adesto Technologies Corporation in the United States and other countries. Other company, product, and service

names may be trademarks or service marks of others. Adesto products are covered by one or more patents listed at http://www.adestotech.com/patents.

Disclaimer: Adesto Technologies Corporation (“Adesto”) makes no warranties of any kind, other than those expressly set forth in Adesto’s Terms and Conditions of Sale at

http://www.adestotech.com/terms-conditions.

Adesto assumes no responsibility or obligations for any errors which may appear in this document, reserves the right to change devices or specifications

herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by Adesto

herewith or in connection with the sale of Adesto products, expressly or by implication. Adesto’s products are not authorized for use in medical applications (including, but not limited to, life support systems

and other medical equipment), weapons, military use, avionics, satellites, nuclear applications, or other high risk applications (e.g., applications that, if they fail, can be reasonably expected to result in

personal injury or death) or automotive applications, without the express prior written consent of Adesto.

19. Revision History

Revision

Date

Change History

6/2016

Initial document release.

7/2016

Updated ordering code table with tray and tape and reel options.

9/2016

Updated Section 11.2.2 description. Corrected Manufacturer ID in Figure 12-1.

Corrected Table 12-16 (4 megabytes). Updated Program and Erase Characteristics.

Corrected Table 6-2 (Opcode 9Fh, data bytes).

3/2017

Updated behavior of DS signal. DS is now driven all the time while CS is low. Timing parameters

for DS (t

RPRE and tCSDS) updated accordingly. DS polarity is changed in SDR mode, DS is now

driven high in the first half of the data output cycle, and low in the second half. Read Array

command (03h opcode, 1-1-1 mode) changed from 4 address bytes to 3. This command is no

longer allowed during Program or Erase, but still allowed during Program/Erase Suspend.

Program OTP Security Register (9Bh) command updated to allow multiple program

operations.Clarifications: The HOLD function is only available while the device remains in

Standard SPI Mode after power up. If the WP pin is left floating, the WPP bit will have an

undefined value. EPE bit description is updated.

11/2017

Added Concurrent Read and Write feature to ordering codes and references. Updated pin

descriptions of WP pin. HOLD functionality removed from IO

3. Updated the description of the

Reset functions. Timing parameters updated to meet JEDEC xSPI spec. Max ICC2 numbers

updated to reflect worst case scenario (Typical values unchanged.) Program and Erase times

updated. Power-Up timing diagrams and description updated.

12/2018

Document status updated from Advanced to Preliminary. Updated maximum operating frequency

for 0Bh and 0Ch read operations. Wrap length 64 not supported. Updated

Table 12-8, Dummy

Clock Cycles and Maximum Operating Frequency — -40

oC to +85 oC and SFDP values

Table 12-35 and Table 12-40 accordingly. Minimum operating voltage changed to 1.7V.

Program and erase times updated. I

DPD and ICC2 updated. SFDP table updated to meet

JESD216C. STR/DTR terms changed to SDR/DDR to match JESD216C.

04/2019

Maximum operating speed is increased to 150MHz for Octal DDR, 166MHz for Quad. Updated

buffer description in section 8.2. Updated Table 11-8 values; removed column for SPI mode.

Updated Table 12-3 EDI Data (Device revision). Updated Section 12-17 SFDP: Basic Parameter

Table 10th, 11th, 16th and 20th DWORD. Updated description and values of last 4 bits in SCCR

Map Parameter Table 3rd and 4th DWORD to match JESD216D. Added/updated Section 12.17.1

SFDP Register Summary. Updated all JESD216C references to JESD216D. 13.5 AC

Characteristics: Updated t

DSDCD,tRQ, tRQH. Removed tCLKR and tCLKF (Redundant parameters).

Added timing for tDSLCSH, updated Fig 15-2 for same. 13.6 Program and Erase Characteristics:

Updated Footnote 2.

10/2019

Removed references to ATXP032R.

Removed references to Quad Mode.

Removed references to QPI mode.

Removed Read-While-Write transfer type.

Updated legal page.

Updated to new Adesto template.

Removed SFDP tables in Section 12.16.1.

Updated all single mode transfers to ‘SDR mode’ nomenclature.

Updated all dual mode transfers to ‘DDR mode’ nomenclature.

Updated contents of Terminate (F0h) row in Table 12-4.

Removed references to sequential programming.

Changed I

LI parameter in DC Characteristics table from 1 to 2 µA.

Updated use of footnotes in Table 13.5, AC Characteristics.

Updated t

XUDPD parameter in Table 13.5, AC Characteristics.

Changed minimum operating voltage from 1.65V to 1.7V.

ATXP032 Datasheet(PDF) 111 Page - Dialog Semiconductor

ATXP032 Datasheet(HTML) 111 Page - Dialog Semiconductor

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL