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RT600 Datasheet(PDF) 142 Page - NXP Semiconductors |
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RT600 Datasheet(HTML) 142 Page - NXP Semiconductors |
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142 / 171 page  RT600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors B.V. 2023. All rights reserved. Product data sheet Rev. 2.1 — 7 July 2023 142 of 173 NXP Semiconductors RT600 Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4 Audio DSP CPUs 16.4.1 RTC Printed Circuit Board (PCB) design guidelines • Connect the crystal and external load capacitors on the PCB as close as possible to the oscillator input and output pins of the chip. • The length of traces in the oscillation circuit should be as short as possible and must not cross other signal lines. • Ensure that the load capacitors Cx and Cy have a common ground plane. • Loops must be made as small as possible to minimize the noise coupled in through the PCB and to keep the parasitics as small as possible. • Lay out the ground (GND) pattern under crystal unit. • Do not lay out other signal lines under crystal unit for multi-layered PCB. |
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