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RT600 Datasheet(PDF) 144 Page - NXP Semiconductors |
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RT600 Datasheet(HTML) 144 Page - NXP Semiconductors |
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144 / 171 page ![]() RT600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors B.V. 2023. All rights reserved. Product data sheet Rev. 2.1 — 7 July 2023 144 of 173 NXP Semiconductors RT600 Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4 Audio DSP CPUs CSTRAY – stray capacitance between XTALIN and XTALOUT pins. For example: CL = 9pF Cx = Cy = 2CL - CPad - 2CSTRAY Cx = Cy = 2*9 - 3 - 0 = 15 pF Although CSTRAY can be ignored in general, the actual board layout and placement of external components influences the optimal values of external load capacitors. Therefore, it is recommended to fine tune the values of external load capacitors on actual hardware board to get the accurate clock frequency. For fine tuning, measure the clock on the CLKOUT pin and optimize the values of external load capacitors for minimum frequency deviation. To use bypass mode on system oscillator, set bit 1 to ‘1’ in the system oscillator control 0 (CLKCTL0_SYSOSCCTL0), float the XTALOUT pin, and drive XTALIN with a 0.8 V to 1.8V square wave. For oscillator high gain mode, a larger voltage swing is used at the crystal pin. This gives a higher noise immunity within the oscillator and less edge to edge jitter of the internal clock. If high gain mode is not required, power used by the crystal oscillator can be reduced by using low power mode. Remark: High gain mode requires a 1 megohm resistor (RF) to be inserted. 16.5.1 XTAL Printed Circuit Board (PCB) design guidelines • Connect the crystal and external load capacitors on the PCB as close as possible to the oscillator input and output pins of the chip. • The length of traces in the oscillation circuit should be as short as possible and must not cross other signal lines. • Ensure that the load capacitors Cx and Cy have a common ground plane. • Loops must be made as small as possible to minimize the noise coupled in through the PCB and to keep the parasitics as small as possible. • Lay out the ground (GND) pattern under crystal unit. • Do not lay out other signal lines under crystal unit for multi-layered PCB. 16.6 Suggested USB interface solutions The USB device can be connected to the USB as self-powered device (see Figure 37) or bus-powered device (see Figure 38). On the RT600, the USB_VBUS pin is 5 V tolerant pin regardless of whether USB1_VDD3V3 or VDD pins are present or not. |
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