ISD5216PI datasheet(75/75 Pages) WINBOND

75 / 75 page

ISD5216

Publication Release Date: Jan. 31, 2006

- 75 -

Revision B.4

Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment

intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation

instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or

sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could

result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.

Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully

indemnify Winbond for any damages resulting from such improper use or sales.

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no

representation or warranties with respect to the accuracy or completeness of the contents of this publication and

reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.

No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this

publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability

whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or

infringement of any Intellectual property.

The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any

express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual

property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for

loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this

documents, even if Winbond has been advised of the possibility of such damages.

Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only

and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.

The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in

the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates

SuperFlash®.

Information contained in this ISD® ChipCorder® datasheet supersedes all data for the ISD ChipCorder products

published by ISD® prior to August, 1998.

This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®

product specifications.

In the event any inconsistencies exist between the information in this and other product

documentation, or in the event that other product documentation contains information in addition to the information in

this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is

subject to change without notice.

Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks

are properties of their respective owners.

ISD5216PI Datasheet(PDF) 75 Page - Winbond