LPC1850 datasheet(52/84 Pages) NXP

Part #	LPC1850

Description	32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD

PDF	84 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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52 / 84 page

LPC1850_30_20_10

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Objective data sheet

Rev. 1 — 3 January 2011

52 of 84

NXP Semiconductors

LPC1850/30/20/10

32-bit ARM Cortex-M3 microcontroller

Thermal characteristics

The average chip junction temperature, Tj (°C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (°C),

• Rth(j-a) = the package junction-to-ambient thermal resistance (°C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However it can be significant

in some applications.

amb

th j

–

()

Table 7.

Thermal characteristics

VDD = 2.2 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified;

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tj(max)

maximum junction

temperature

--<tbd>

°C

LPC1850 Datasheet(PDF) 52 Page - NXP Semiconductors