LPC1850 datasheet(68/84 Pages) NXP

68 / 84 page

LPC1850_30_20_10

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Objective data sheet

Rev. 1 — 3 January 2011

68 of 84

NXP Semiconductors

LPC1850/30/20/10

32-bit ARM Cortex-M3 microcontroller

11.6 Dynamic external memory interface

Table 15.

Dynamic characteristics: Dynamic external memory interface

CL =30 pF; Tamb = −40 °C to 85 °C; VDD(REG)(3V3) and VDD(IO) over specified ranges <tbd>; AHB clock = 1 MHz.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Common

td(SV)

chip select valid delay time

<tbd>

th(S)

chip select hold time

<tbd>

td(RASV)

row address strobe valid delay time

<tbd>

th(RAS)

row address strobe hold time

<tbd>

td(CASV)

column address strobe valid delay time

<tbd>

th(CAS)

column address strobe hold time

<tbd>

td(WV)

write valid delay time

<tbd>

th(W)

write hold time

<tbd>

td(GV)

output enable valid delay time

<tbd>

th(G)

output enable hold time

<tbd>

td(AV)

address valid delay time

<tbd>

th(A)

address hold time

<tbd>

Read cycle parameters

tsu(D)

data input set-up time

<tbd>

th(D)

data input hold time

<tbd>

Write cycle parameters

td(QV)

data output valid delay time

<tbd>

th(Q)

data output hold time

<tbd>

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