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UPD6466GS Datasheet(PDF) 68 Page - NEC

Part # UPD6466GS
Description  ON-SCREEN CHARACTER DISPLAY CMOS IC FOR 512-CHARACTER, 12-ROW, 24-COLUMN, CAMERA-CONTAINED VCR
PDF  70 Pages
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

UPD6466GS Datasheet(HTML) 68 Page - NEC

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µPD6466
9. RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface mount devices
µPD6466GS-xxx: 20-pin plastic shrink SOP (300 mil)
µPD6466GT-xxx: 24-pin plastic SOP (375 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°C or below (Package surface temperature),
IR35-00-2
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 2 times.
VPS
Peak temperature: 215
°C or below (Package surface temperature),
VP15-00-2
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 2 times.
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°C or below (Package surface temperature).
Partial heating method
Pin temperature: 300
°C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.



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