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AX5243 Datasheet(PDF) 64 Page - ON Semiconductor |
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AX5243 Datasheet(HTML) 64 Page - ON Semiconductor |
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64 / 65 page ![]() QFN28 Package Information www.onsemi.com AX5243 64 6. The fine pitch of the IC leads requires accurate alignment of the stencil and the printed circuit board. The stencil and printed circuit assembly should be aligned to within + 1 mil prior to application of the solder paste. 7. No-clean flux is recommended since flux from underneath the thermal pad will be difficult to clean if water-soluble flux is used. Figure 16: Solder paste application on exposed pad Minimum 50% coverage 62% coverage Maximum 80% coverage Figure 17: Solder paste application on pins |
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