DLPC900 datasheet(21/72 Pages) TI1

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DLPC900

www.ti.com

DLPS037A – OCTOBER 2014 – REVISED AUGUST 2015

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted). The functional performance of the device specified in this

data sheet is achieved when operating the device by the Recommended Operating Conditions. No level of performance is

implied when operating the device above or below the Recommended Operating Conditions limits.

I/O (1)

MIN

NOM

MAX

UNIT

VDD33

3.3 V supply voltage, I/O

3.135

3.3

3.465

1.8 V supply voltage, LVDSAVD and

VDD18

1.71

1.8

1.89

DRAMVDD

VDDC

1.15 V supply voltage, Core logic

1.100

1.15

1.200

PLLD_VDD

1.8 V supply voltage, PLL analog

1.71

1.8

1.89

PLLM1_VDD

1.8 V supply voltage, PLL analog

1.71

1.8

1.89

PLLM2_VDD

1.8 V supply voltage, PLL analog

1.71

1.8

1.89

PLLS_VDD

1.15 V supply voltage, PLL analog

1.090

1.15

1.200

PLLD_VDD

1.15 V supply voltage, PLL digital

1.090

1.15

1.200

PLLM1_VDD

1.15 V supply voltage, PLL digital

1.090

1.15

1.200

PLLM2_VDD

1.15 V supply voltage, PLL digital

1.090

1.15

1.200

USB (9)

VDD33

OSC (10)

VDD33

Input voltage

3.3 V LVTTL (1, 2, 3, 4)

VDD33

3.3 V I2C (8)

VDD33

USB (8)

VDD33

3.3 V LVTTL (1, 2, 3, 4)

VDD33

Output voltage

3.3 V I2C (8)

VDD33

1.8 V LVDS (7)

VDD18

Operating ambient temperature range

See (2) and (3)

°C

Operating top-center case temperature

See (3) and (4)

109.16

°C

Operating junction temperature

111

°C

(1)

The number inside the parentheses for the I/O refers to the I/O type defined in Table 1.

(2)

Assumes minimum 1 m/s airflow.

(3)

Maximum thermal values assume max power of 4.76 W (total for controller).

(4)

Assume

φJT equals 0.4°C/W.

6.4 Thermal Information

DLPC900

THERMAL METRIC

ZPC (BGA)

UNIT

516 PINS

RθJC

(1)

Junction-to-air thermal resistance

4.4

°C/W

RθJA at 0 m/s of forced airflow

(2)

Junction-to-air thermal resistance

14.4

°C/W

RθJA at 1 m/s of forced airflow

(2)

Junction-to-air thermal resistance

9.5

°C/W

RθJA at 2 m/s of forced airflow

(2)

Junction-to-air thermal resistance

9.0

°C/W

φJT

(3)

Temperature variance from junction to package top center

0.4

°C/W

temperature, per unit power dissipation

(1)

RθJC analysis assumptions: The heat generated in the chip flows into overmold (top side) and also into the package laminate (bottom

side) and then into PCB via package solder balls. Should be used for heat sink analysis only.

(2)

Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC defined

standard test PCB. This JEDEC test PCB is not necessarily representative of the DLPC900 PCB and thus the reported thermal

resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best

information available during the design phase to estimate thermal performance.

(3)

Example: (3.2 W) × (0.4 C/W)

≈ 1.28°C temperature rise.

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