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PEB2256HT Datasheet(PDF) 474 Page - Infineon Technologies AG |
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PEB2256HT Datasheet(HTML) 474 Page - Infineon Technologies AG |
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474 / 490 page ![]() FALC56 V1.2 PEB 2256 Electrical Characteristics Data Sheet 474 2002-08-27 11.5 Capacitances 11.6 Package Characteristics Figure 105 Thermal Behavior of Package Parameter Symbol Limit Values Unit Notes min. max. Input capacitance 1) C IN 510 pF Output capacitance 1) C OUT 815 pF all except XLx Output capacitance 1) C OUT 820 pF XLx 1) Not tested in production. Table 88 Package Characteristic Values Parameter Symbol Limit Values Unit Notes min. typ. max. Thermal Resistance MQFP Rthjam 1) 1) R thja = (Tjunction - Tambient)/Power Not tested in production. 47 K/W single layer PCB, no convection Rthjc 2) 2) R thjc = (Tjunction - Tcase)/Power Not tested in production. 9K/W Thermal Resistance BGA Rthjab1) 29 K/W single layer PCB, natural convection Junction Temperature Rj 125 °C F0051 |
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