PCM5252 datasheet(7/119 Pages) TI1

7 / 119 page

PCM5252

www.ti.com

SLASE63 – NOVEMBER 2014

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVDD, CPVDD, DVDD

–0.3

3.9

Supply Voltage

LDOO wtih DVDD at 1.8V

–0.3

2.25

DVDD at 1.8V

–0.3

2.25

Digital Input Voltage

DVDD at 3.3V

–0.3

3.9

Analog Input Voltage

–0.3

3.9

8.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage Temperature

–40

125

°C

Human body model (HBM), per

–2500

2500

ANSI/ESDA/JEDEC JS-001, all pins(1)

Electrostatic

V(ESD)

Discharge

Charged device model (CDM), per JEDEC

–1500

1500

specification JESD22-C101, all pins

(1)

Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows

safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCOM mode

3.0

3.3

3.46

Referenced to

AVDD

Analog power supply voltage range

AGND(1)

VREF mode

3.2

3.3

3.46

1.8V DVDD

1.65

1.8

1.95

Referenced to

DVDD

Digital power supply voltage range

DGND(1)

3.3V DVDD

3.1

3.3

3.46

CPVDD

Charge pump supply voltage range

Referenced to CPGND(1)

3.1

3.3

3.46

MCLK

Master Clock Frequency

MHz

LOL, LOR

Stereo line output load resistance

Ω

CLout

Digital output load capacitance

Operating Junction Temperature Range

–25

°C

(1)

All grounds on board are tied together; they must not differ in voltage by more than 0.2V max, for any combination of ground signals.

8.4 Thermal Information

THERMAL METRIC

RHB (32 PINS)

UNIT

RθJA

Junction-to-ambient thermal resistance

72.2

RθJC(top)

Junction-to-case(top) thermal resistance

17.5

RθJB

Junction-to-board thermal resistance

35.0

°C/W

ψJT

Junction-to-top characterization parameter

0.4

ψJB

Junction-to-board characterization parameter

34.5

RθJC(bottom)

Junction-to-case(bottom) thermal resistance

n/a

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