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LM5145 Datasheet(PDF) 63 Page - Texas Instruments |
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LM5145 Datasheet(HTML) 63 Page - Texas Instruments |
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63 / 69 page  www.ti.com EXAMPLE BOARD LAYOUT ( 0.2) TYP VIA (0.825) (0.575) TYP (0.825) (0.575) 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 40X (0.25) 40X (0.6) 36X (0.5) (5.8) (5.8) ( 3.3) (R0.05) TYP VQFN - 1 mm max height RHA0040P PLASTIC QUAD FLATPACK - NO LEAD 4226761/A 04/2021 SYMM 1 10 11 20 21 30 31 40 SYMM LAND PATTERN EXAMPLE SCALE:15X 41 SEE SOLDER MASK DETAIL NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DETAILS DEFINED (PREFERRED) www.ti.com LM25143 SNVSC10 – MARCH 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 63 Product Folder Links: LM25143 |
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