LM5145 datasheet(8/69 Pages) TI

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8.3 Recommended Operating Conditions

Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted).

MIN

NOM

MAX

UNIT

VIN

Input voltage

range

VIN to PGND

–0.3

SW1, SW2 to PGND

–0.3

HB1 to SW1, HB2 to SW1

–0.3

5.25

HO1 to SW1, HOL1 to SW1, HO2 to SW2, HOL2 to SW2

–0.3

VHB + 0.3

LO1, LOL1, LO2, LOL2 to PGND

–0.3

5.25

FB1, FB2, SS1, SS2, COMP1, COMP2, RES, DEMB,

RT, MODE, DITH to AGND

–0.3

5.25

EN1, EN2 to PGND

–0.3

VCC, VDDA to PGND

–0.3

5.25

VOUT1, VOUT2, CS1, CS2 to PGND

–0.3

PGND to AGND

–0.3

0.3

Operating

junction

temperature

–40

150

°C

8.4 Thermal Information

THERMAL METRIC(1)

RHA (VQFNP)

UNIT

40 PINS

RθJA

Junction-to-ambient thermal resistance

34.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

22.8

°C/W

RθJB

Junction-to-board thermal resistance

9.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.3

°C/W

ΨJB

Junction-to-board characterization parameter

9.4

°C/W

ΨJT

Junction-to-top characterization parameter

0.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LM25143

SNVSC10 – MARCH 2022

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