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PACKAGE OUTLINE

3.6

3.4

3.1

2.9

0.7

0.6

0.01

0.00

2X 1.5

.000 PKG

0

2X 1

2X 0.5

2X 0.5

2X 1

2X 1.5

26X 0.3

0.2

0.888 0.1

1.4 0.1

0.556

2X

0.862 0.1

2X 0.188

6X 0.55

0.35

2X 0.6

0.4

2X 0.55

0.35

8X 0.475

0.275

0.5

0.3

2X 1.45

1.25

2X 0.6 0.1

26X (0.2)

(0.2) TYP

WQFN-FCRLF - 0.7 mm max height

RZR0016A

PLASTIC QUAD FLATPACK - NO LEAD

4228859/A 07/2022

0.08 C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

0.1

C A B

0.05

C

PIN 1 ID

(45 X 0,3)

1

5

7

11

15

16

SCALE 3.500

A

B

C

TPS54KB20

SLVSGP3 – MAY 2023

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