PC7410 datasheet(12/57 Pages) ETC2

12 / 57 page

0832F–HIREL–02/07

PC7410

e2v semiconductors SAS 2007

Thermal Characteristics

7.1

Package Characteristics

Notes:

1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-

ture, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

See “Thermal Management Information” on page 13 for more details about thermal management.

The board designer can choose between several commercially available heat sink types to place on the

PC7410. For exposed-die packaging technology as in Table 7-1, the intrinsic conduction thermal resis-

tance paths are shown in Figure 7-1 on page 13.

7.1.1

Package Thermal Characteristics for HiTCE

Table 7-2 provides the package thermal characteristics for the PC7410, HiTCE.

Notes:

1. Simulation, no convection air flow.

2. Per JEDEC JESD51-6 with the board horizontal.

Table 7-1.

Package Thermal Characteristics CBGA

Symbol

Characteristic

Value

PC7410 CBGA

Unit

RθJA

Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board(1)(2)

° C/W

RθJMA

Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board(1)(3)

° C/W

RθJMA

Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board(1)(3)

° C/W

RθJMA

Junction-to-ambient thermal resistance, 400 ft/min airflow, single-layer (1s) board

° C/W

RθJMA

Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board(1)(3)

° C/W

RθJMA

Junction-to-ambient thermal resistance, 400 ft/min airflow, four-layer (2s2p) board

° C/W

RθJB

Junction-to-board thermal resistance(4)

° C/W

RθJC

Junction-to-case thermal resistance(5)

< 0.1

° C/W

Table 7-2.

Package Thermal Characteristics for HiTCE Package

Characteristic

Symbol

Value

Unit

PC7410 HiTCE

Junction-to-bottom of balls(1)

6.8

° C/W

Junction-to-ambient thermal resistance, natural

convection, four-layer (2s2p) board(1)(2)

JMA

20.7

° C/W

Junction to board thermal resistance

11.0

° C/W

PC7410 Datasheet(PDF) 12 Page - List of Unclassifed Manufacturers

PC7410 Datasheet(HTML) 12 Page - List of Unclassifed Manufacturers

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57

Datasheet Download

Link URL