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0832F–HIREL–02/07
e2v semiconductors SAS 2007
PC7410
Figure 12-7. Mechanical Dimensions and Bottom Surface Nomenclature of the 360-ball HiTCE Package
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M, 1994
2. Dimensions in millimeters
3. Top side A1 corner index is a metallized feature with various shapes. Bottom side A1 corner is designated with a ball missing
from the array
Package
Caps
Value
µF
Voltage
Reference
C1-1
0.01
L2OVDD
C1-2
GND
C2-1
0.01
L2OVDD
C2-2
GND
C3-1
0.01
VDD
C3-2
GND
C4-1
0.01
OVDD
C4-2
GND
C5-1
0.01
OVDD
C5-2
GND
C6-1
0.01
VDD
C6-2
GND
Millimeters
DIM
MIN
MAX
A
2,72
3,2
A1
0,8
1
A2
1,1
1,3
A3
0,6
A4
0,82
0,9
b
0,82
0,93
D
25 BSC
D2
10 typ
D3
6,32
e1,27 BSC
E
25 BSC
E2
12,6 typ
E3
8,26
J1
0,89 BSC
J2
3,2 BSC
J3
0,68 BSC
K1
6,56
K2
8,13
L1
8,61
L2
7,04
B
C
360X
e
1 2 3 4 5 6 7 8 9 10 11 1213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
C
0.15
B
171819
U
W
V
D2
D3
D
C6-2
C6-1
E2
E
B
E3
0.2
2X
0.2
2X
A
C1-1
C1-2
12X
J2
L2 L1
C5-1
C5-2
C2-2
C2-1
C4-1
C3-1
C3-2
C4-2
12X
J1
12X
J3
K2
K1
A1 CORNER
0.15 A
0.25 A
0.35 A
C
A3
A2
A4
A1
A
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