TDA8296 datasheet(53/87 Pages) NXP

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TDA8296

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Product data sheet

Rev. 1 — 3 March 2011

53 of 87

NXP Semiconductors

TDA8296

Digital global standard low IF demodulator for analog TV and FM radio

10. Limiting values

[1]

Stresses above the absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum ratings

conditions for extended periods may affect device reliability.

[2]

Tj depends on the assembly condition of the package and especially on the design of the PCB. The application mounting must be done

in such a way that the maximum junction temperature Tj(max) is never exceeded.

[3]

No power sequence requirement

[4]

Class IV according to EIA/JESD22-C101.

11. Thermal characteristics

The thermal resistance depends strongly on the nature of the PCB used in the application

and on its design. The thermal resistance given in Table 63 corresponds to the value that

can be measured on a multilayer PCB (4 layers) as defined by EIA/JESD51-2. This value

is given for information only.

The junction temperature influences strongly the reliability of an IC. The PCB used in the

application contributes on a large part to the overall thermal characteristic. It must

therefore be designed to insure that the junction temperature of the IC never exceeds

Tj(max) = 125 °C at the maximum ambient temperature.

The IC has to be soldered to ground with its die-attached paddle. Plenty of vias are

recommended to remove the heat.

Table 62.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).[1][2][3]

Symbol

Parameter

Conditions

Min

Max

Unit

VDDD(1V2)

digital supply voltage (1.2 V)

−0.5

+1.5

VDDDR(3V3)

ring digital supply voltage (3.3 V)

−0.5

+4.6

VDDA(ADC)(1V2)

ADC analog supply voltage (1.2 V)

−0.5

+1.5

VDDA(PLL)(1V2)

PLL analog supply voltage (1.2 V)

−0.5

+1.5

VDDA(DAC)(3V3)

DAC analog supply voltage (3.3 V)

−0.5

+4.6

input voltage

pins XIN, IF_POS and

IF_NEG

−0.5

+1.3

digital input pins

−0.5

+4.6

Tlead

lead temperature

300

°C

Ptot

total power dissipation

Tamb = 85 °C

0.5

Tstg

storage temperature

−40

+125

°C

junction temperature

+125

°C

Tamb

ambient temperature

−20

+85

°C

VESD

electrostatic discharge voltage

all pins:

Field ind. Charge Device

Model (FCDM)

[4] -

±1000

Human Body Model (HBM)

±4000

Table 63.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

Rth(j-a)

thermal resistance from junction to

ambient

in still air

36.8

K/W

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