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LPC4370 Datasheet(PDF) 116 Page - NXP Semiconductors |
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LPC4370 Datasheet(HTML) 116 Page - NXP Semiconductors |
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116 / 150 page ![]() LPC4370 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 2 — 21 October 2013 116 of 150 NXP Semiconductors LPC4370 32-bit ARM Cortex-M4/M0 microcontroller [1] Parameters specified for 40 % of VDD(IO) for rising edges and 60 % of VDD(IO) for falling edges. [2] Tcy(clk) = 1/CCLK (see LPC43xx User manual). [3] End Of Read (EOR): longest of tCSHOEH, tOEHANV, tCSHBLSH. [4] Start Of Read (SOR): longest of tCSLAV, tCSLOEL, tCSLBLSL. [5] End Of Write (EOW): earliest of address not valid or EMC_BLSn HIGH. tBLSHEOW BLS HIGH to end of write time PB = 0 [2] [5] 1.9 + T cy(clk) - 0.5 + T cy(clk) ns tBLSHDNV BLS HIGH to data invalid time PB = 0 [2] 2.5 + T cy(clk) - 1.4 + Tcy(clk) ns tCSHEOW CS HIGH to end of write time [5] 2.0 - 0 ns tBLSHDNV BLS HIGH to data invalid time PB = 1 2.5 - 1.4 ns tWEHANV WE HIGH to address invalid time PB = 1 0.9 + T cy(clk) - 2.4 + Tcy(clk) ns Table 26. Dynamic characteristics: Static asynchronous external memory interface …continued CL = 22 pF for EMC_Dn CL = 20 pF for all others; Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V V DD(IO) 3.6 V; values guaranteed by design. Timing parameters are given for single memory access cycles. In a normal read operation, the EMC changes the address while CS is asserted which results in multiple memory accesses. Symbol Parameter[1] Conditions Min Typ Max Unit Fig 31. External static memory read/write access (PB = 0) tCSLDV tCSLBLSL tCSHEOW tBLSHEOW tCSLAV EOR SOR EOW EMC_An EMC_CSn EMC_OE EMC_BLSn EMC_WE EMC_Dn 002aag699 tCSHOEH tOEHANV tCSHEOR tam tCSLSOR tOELOEH tCSLOEL tCSLAV th(D) tBLSLBLSH tBLSHDNV |
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