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FG256 Datasheet(PDF) 33 Page - Actel Corporation |
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FG256 Datasheet(HTML) 33 Page - Actel Corporation |
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33 / 108 page  SX-A Family FPGAs v5.3 2-13 To determine the heat sink's thermal performance, use the following equation: EQ 2-14 where: EQ 2-15 A heat sink with a thermal resistance of 9.76°C/W or better should be used. Thermal resistance of heat sinks is a function of airflow. The heat sink performance can be significantly improved with the presence of airflow. Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA. Design engineers should always correlate the power consumption of the device with the maximum allowable power dissipation of the package selected for that device, using the provided thermal resistance data. Note: The values may vary depending on the application. θ JA(TOTAL) θ JC θ CS θ SA ++ = θ CS = 0.37°C/W = thermal resistance of the interface material between the case and the heat sink, usually provided by the thermal interface manufacturer θ SA = thermal resistance of the heat sink in °C/W θ SA θ JA(TOTAL) θ JC – θ CS – = θ SA 13.33 °C/W 3.20°C/W – 0.37 °C/W – = θ SA 9.76 °C/W = |
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