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PC87382 Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # PC87382
Description  LPC-to-LPC Switch for Docking Stations, with Fast Infrared Port, Serial Port and GPIOs
PDF  72 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

PC87382 Datasheet(HTML) 4 Page - National Semiconductor (TI)

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4
Revision 1.2
Table of Contents
1.0
Signal/Pin Connection and Description
1.1
CONNECTION DIAGRAM ...........................................................................................................8
1.2
BUFFER TYPES AND SIGNAL/PIN DIRECTORY ...................................................................... 9
1.3
DETAILED SIGNAL/PIN DESCRIPTIONS ................................................................................ 10
1.3.1
LPC Bus Interface ....................................................................................................... 10
1.3.2
Docking LPC Bus ........................................................................................................ 10
1.3.3
Clocks .......................................................................................................................... 10
1.3.4
Infrared (IR) ................................................................................................................ 11
1.3.5
Serial Port (SP1) ..........................................................................................................11
1.3.6
General-Purpose Input/Output (GPIO) Ports ............................................................... 11
1.3.7
Power and Ground ..................................................................................................... 12
1.3.8
Strap Configuration ...................................................................................................... 12
1.3.9
Test and Miscellaneous ............................................................................................... 12
1.4
INTERNAL PULL-UP AND PULL-DOWN RESISTORS ............................................................ 13
2.0
Power, Reset and Clocks
2.1
POWER ..................................................................................................................................... 14
2.1.1
Power Planes .............................................................................................................. 14
2.1.2
Power States ...............................................................................................................14
2.1.3
Power Connection and Layout Guidelines .................................................................. 14
2.2
RESET SOURCES AND TYPES ............................................................................................... 15
2.2.1
VDD Power-Up Reset .................................................................................................. 15
2.2.2
Hardware Reset ........................................................................................................... 15
2.3
CLOCK DOMAINS ..................................................................................................................... 15
2.3.1
LPC Domain ................................................................................................................ 15
2.3.2
48 MHz Domain ........................................................................................................... 15
2.3.3
Chip Power-Up ............................................................................................................ 16
2.3.4
Specifications .............................................................................................................. 16
2.4
TESTABILITY SUPPORT ..........................................................................................................16
2.4.1
ICT ............................................................................................................................... 16
2.4.2
XOR Tree Testing ........................................................................................................ 16
2.4.3
Test Mode Entry Sequence ......................................................................................... 17
3.0
Device Architecture and Configuration
3.1
OVERVIEW ............................................................................................................................... 18
3.2
CONFIGURATION STRUCTURE AND ACCESS ..................................................................... 18
3.2.1
The Index-Data Register Pair ...................................................................................... 18
3.2.2
Banked Logical Device Registers Structure ................................................................ 19
3.2.3
Standard Configuration Register Definitions ............................................................... 20
3.2.4
Standard Configuration Registers ............................................................................... 22
3.2.5
Default Configuration Setup ........................................................................................ 23
3.3
MODULE CONTROL ................................................................................................................. 24
3.3.1
Module Enable/Disable ................................................................................................ 24



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