CS5530A datasheet(257/259 Pages) AMD

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AMD Geode™ CS5530A Companion Device Data Book

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Appendix A: Support Documentation

Revision 1.1

Appendix ASupport Documentation

A.1

Revision History

This document is a report of the revision/creation process of the architectural specification for the CS5530A companion

device. Any revisions (i.e., additions, deletions, parameter corrections, etc.) are recorded in the table(s) below.

Table A-1. Revision History

Revision #

(PDF Date)

Revisions / Comments

0.1 (4/2/00)

Completed formatting first-pass of spec. Current spec is updated version of CS5530 data book with

additional inputs from engineering. Differences between this spec’s revision and the CS5530 data

book are denoted with a change bar in the margin. Still need to proof-read for “ripple effects” made by

engineering changes for next rev.

0.2 (6/16/00)

Corrections from Issues 1.3.

0.3 (6/27/00)

Further corrections from Issues 1.3. Partly indexed.

0.4 (7/5/00)

Corrections from Issues 1.3 and 1.5. Some issues remain to be resolved. Index markers inserted

through AT chapter.

0.5 (7/19/00)

TME/Tech Pubs edits. See document revision 0.5 for revision history.

0.6 (8/7/00)

TME/Tech Pubs edits. See document revision 0.6 for revision history details.

0.7(9/18/00)

TME/Tech Pubs/Engr edits. See document revision 0.7 for revision history details.

Note:

Next revision to include section on “recommended soldering parameters” in Section 8.0

"Physical Dimensions".

1.0 (11/10/00)

TME/Tech Pubs/Engr edits. See document revision 1.0 for revision history details.

Note:

Will create separate applications note on “recommended soldering parameters” as opposed

to adding as subsection in data book.

1.1 (5/1/01)

TME/Engr edits. See Table A-2 for details.

Note:

Will not create separate applications note on “recommended soldering parameters”. Applica-

tions is fulfilling any customer inquiries with a document supplied by the Quality Group.

Table A-2. Edits to Create Revision 1.1

Section

Description

Section 3.0 "Signal Definitions"

Section 3.2.2 "Clock

Interface"

• Changed last sentence of DCLK signal description on page 29.

Did say: “However, system constraints limit DCLK to 150 MHz when DCLK is used as the

graphics subsystem clock.”

Now says: “However, when DCLK is used as the graphics subsystem clock, the Geode

processor determines the maximum DCLK frequency.”

Section 3.2.11 "Dis-

play Interface"

• Changed resistor value in IREF signal description (from 732 ohm to 680 ohm) on page 41.

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