5

TPS66020, TPS66021

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SLVSEW8 – AUGUST 2019

Product Folder Links: TPS66020 TPS66021

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Copyright © 2019, Texas Instruments Incorporated

(1)

All voltage values are with respect to network GND. GND pin must be connected directly to the ground plane of the board.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, TPS66020 only.

2.85

3.6

V

VIN, TPS66021 only.

4.5

5.5

V

PP5V

4.9

5.5

V

PPHV

0

22

V

VBUS when sourcing

0

5.5

V

VBUS when sinking

4

22

V

EN0, EN1

0

5.5

V

FLT

0

5.5

V

Continuous current from PP5V to

VBUS

3

A

Continuous current from VBUS to

PPHV

4

A

5

A

Output current from VBUS LDO

30

mA

External resistor current limit

reference

75k

Ω ±1% overall tolerance

74.25

75.75

k

Ω

Operating junction temperature

–10

125

°C

RR_PP5V

Maximum ramp rate on PP5V input supply

–2

2

V/µs

RR_PPHV

Maximum ramp rate on PPHV input supply

–2

2

V/µs

RR_VBUS

Maximum ramp rate on VBUS input supply

–2

2

V/µs

RR_VIN

Maximum ramp rate on VIN input supply

30

mV/µs

(1)

Capacitance values do not include any derating factors. For example, if 5.0 µF is required and the external capacitor value reduces by

50% at the required operating voltage, then the required external capacitor value would be 10 µF.

(2)

This capacitance represents the system side load capacitance that may be seen by the device e.g. from a typical battery charging

system. Discrete capacitance is not required for proper operation.

6.4 Recommended Supply Load Capacitance

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

CVIN

Capacitance on VIN

1

µF

CVLDO

Capacitance on VLDO

2.5

4.7

10

µF

CVBUS

Capacitance on VBUS

1

10

µF

CPP5V

Capacitance on PP5V

2.5

4.7

µF

CPPHV

1

47

100

µF

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Models based on typical application layout.

6.5 Thermal Information

TPS6602x

UNIT

YBG (WCSP)

28 PINS

44.3

°C/W

Junction-to-ambient thermal resistance

62.7

°C/W

Junction-to-case (top) thermal resistance

0.4

°C/W

Junction-to-board thermal resistance

13.8

°C/W

Junction-to-top characterization parameter

0.2

°C/W

Junction-to-board characterization parameter

13.7

°C/W

14.5

°C/W