ADPD188GG datasheet(9/61 Pages) AD

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Data Sheet

ADPD188GG

Rev. B | Page 9 of 61

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

VDD1, VDD2 to AGND

−0.3 V to +2.2 V

VDD1, VDD2 to DGND

−0.3 V to +2.2 V

EXT_IN1/EXT_IN2

−0.3 V to +2.2V

GPIO0/GPIO1 to DGND

−0.3 V to +2.2 V

MISO/MOSI/SCLK/CS to DGND

−0.3 V to +2.2 V

LEDx/DNC to LGND

−0.3 V to +3.6 V

SCL/SDA to DGND

−0.3 V to +3.6 V

VLEDx to LGND1

−0.3 V to +5.0 V

Electrostatic Discharge (ESD)

Human Body Model (HBM)

3000 V

Charged Device Model (CDM)

1250 V

Machine Model (MM)

100 V

Solder Reflow (Pb-Free)

Peak Temperature

260 (+0/−5)°C

Time at Peak Temperature

<30 sec

Temperature Range

Powered

−40°C to +85°C

Storage

−40°C to +105°C

Junction Temperature

105°C

The absolute maximum voltage allowable between VLEDx and LGND is the

voltage that causes the LEDx/DNC pins to reach or exceed their absolute

maximum voltage.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 7. Thermal Resistance

Package Type1

Supply Pins

θJA

Unit

CE-24-1

ASIC

VDD1, VDD2

°C/W

LED1

VLED1

156

°C/W

Thermal impedance simulated values are based on JEDEC 2S2P and two

thermal vias. See JEDEC JESD51.

RECOMMENDED SOLDERING PROFILE

Figure 4 and Table 8 provide details about the recommended

soldering profile.

t25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

TSMIN

TSMAX

Figure 4. Recommended Soldering Profile

Table 8. Recommended Soldering Profile

Profile Feature

Condition (Pb-Free)

Average Ramp Rate (TL to TP)

2°C/sec max

Preheat

Minimum Temperature (TSMIN)

150°C

Maximum Temperature (TSMAX)

200°C

Time, TSMIN to TSMAX (tS)

60 sec to 120 sec

TSMAX to TL Ramp-Up Rate

2°C/sec max

Time Maintained Above Liquidous

Temperature

Liquidous Temperature (TL)

217°C

Time (tL)

60 sec to 150 sec

Peak Temperature (TP)

260 (+0/−5)°C

Time Within 5°C of Actual Peak

Temperature (tP)

<30 sec

Ramp-Down Rate

3°C/sec max

Time 25°C to Peak Temperature

8 minutes max

ESD CAUTION

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