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ADF4372 Datasheet(PDF) 8 Page - Analog Devices |
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ADF4372 Datasheet(HTML) 8 Page - Analog Devices |
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8 / 47 page ![]() ADF4372 Data Sheet Rev. 0 | Page 8 of 47 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter Rating AV DD Rails to GND 1 −0.3 V to +3.6 V AV DD Rails to Each Other −0.3 V to +0.3 V VCC_VCO to GND1 −0.3 V to +5.5 V VCC_VCO to AV DD −0.3 V to AV DD + 2.8 V CPOUT to GND1 −0.3 V to AV DD + 0.3 V VTUNE to GND −0.3 V to AV DD + 0.3 V Digital Input and Output Voltage to GND1 −0.3 V to AV DD + 0.3 V Analog Input and Output Voltage to GND1 −0.3 V to AV DD + 0.3 V REFP and REFN to GND1 −0.3 V to AV DD + 0.3 V REFP to REFN ±2.1 V Temperature Operating Range −40°C to +105°C Storage Range −65°C to +125°C Maximum Junction 125 °C Reflow Soldering Peak 260°C Time at Peak 30 sec Electrostatic Discharge (ESD) Charged Device Model 1.0 kV Human Body Model 4.0 kV Transistor Count Complementary Metal-Oxide Semiconductor (CMOS) 131,439 Bipolar 4063 1 GND = 0 V. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required. θJA is the natural convection, junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 4. Thermal Resistance Package Type θ JA θ JC Unit CC-48-41 25 14.4 °C/W 1 Test Condition 1: thermal impedance simulated values are based on JESD51 standard. ESD CAUTION |
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