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IMX95CEC Datasheet(PDF) 13 Page - NXP Semiconductors

Part # IMX95CEC
Description  i.MX 95 Applications Processors Data Sheet for Commercial Products
PDF  113 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMX95CEC Datasheet(HTML) 13 Page - NXP Semiconductors

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Table 11. Absolute maximum ratings...continued
Symbol
Description
Min
Typ
Max
Unit
Condition
VDD_ETH_0P8
Digital supply for Ethernet PHY -0.3
—
0.96
V
—
VDD_ETH_1P8
I/O voltage supply and analog
high voltage power supply 1
-0.3
—
2.16
V
—
VDD_LVDS_1P8
LVDS PHY supply voltage
-0.3
—
2.16
V
—
VDD_ANA_0P8
Analog core supply voltage
-0.3
—
0.96
V
—
VDD_ANA_1P8
Analog core supply voltage 1
-0.3
—
2.16
V
—
VDD_ANAVDET_
1P8
Analog core supply voltage
-0.3
—
2.16
V
—
TSTORAGE
Storage temperature range
-55
—
150
℃
—
1. This supply being incorrect can cause the IO pads to be misconfigured causing damage.
4.1.2 Electrostatic discharge and latch-up ratings
Table 12. Electrostatic discharge and latch-up ratings
Symbol
Description
Min
Typ
Max
Unit
Condition
VHBM
Electrostatic Discharge (ESD):
Human Body Model (HBM) 1
-1000
—
1000
V
—
VCDM
Electrostatic Discharge (ESD):
Charged Device Model (CDM) 2
-250
—
250
V
—
ILAT
Latch UP (LU) Immunity level:
Class I at 25 °C ambient
temperature 3
-100
—
100
mA
—
ILAT
Latch UP (LU) Immunity level:
Class II at 105 °C ambient 3
-100
—
100
mA
—
1. Determined according to JEDEC Standard JS001, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model
(HBM).
2. Determined according to JEDEC Standard JS002, Field-Induced Charged-Device Model Test Method for Electrostatic-
Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78, IC Latch-up Test.
4.1.3 Thermal resistance
4.1.3.1 15 x 15 mm FCBGA package thermal characteristics
Table 13 displays the 15 x 15 mm FCBGA package thermal resistance data.
Table 13. 15 x 15 mm FCBGA thermal resistance data
Rating
Board Type1
Symbol
Value
Unit
Junction to Ambient Thermal Resistance2
JESD51-9, 2s2p
RθJA
15.7
℃/W
Junction-to-Top of Package
JESD51-9, 2s2p
ψJT
0.1
℃/W
Table continues on the next page...
NXP Semiconductors
IMX95CEC
i.MX 95 Applications Processors Data Sheet for Commercial Products
IMX95CEC
All information provided in this document is subject to legal disclaimers.
© 2024 NXP B.V. All rights reserved.
Preliminary Data Sheet
Rev. 2 — 11 November 2024
Preliminary - Subject to Change Without Notice
13 / 113



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