PCM5310PAP datasheet(95/103 Pages) TI

95 / 103 page

BOARD DESIGN AND LAYOUT CONSIDERATIONS

POWER-SUPPLY PINS

ANALOG INPUT PINS

LINE OUTPUT PINS

HEADPHONE OUTPUT PINS

COMMON VOLTAGE PINS

REFERENCE VOLTAGE PINS

DIGITAL OUTPUT PINS

PCM5310

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The digital and analog power supplies (VCC, VCCDA, VCCAD, VCCP, and VCCH) to the PCM5310 should be

bypassed to the corresponding ground pins with a 1-

µF to 4.7-µF electrolytic or ceramic capacitor, placed as

close to the pins as possible to maximize the dynamic performance of ADC, DAC, and other analog circuits. If

the power supply includes high-frequency noise, it is recommended to add a 0.1

µF ceramic capacitor as close

as possible to the power-supply lines to improve the dynamic performance.

To maximize the dynamic performance of the ADC, DAC, and other analog circuits, the analog and ground pins

(DGND, AGNDDA, AGNDAD, PGND, HGND and AGNDS) are not connected internally. These grounds should

have a low impedance to avoid digital noise feeding to the analog ground. Therefore, they should be connected

directly to each other under the device to reduce the potential of a noise problem.

All analog input pins (AIN1L/AIN1R to AIN6L/AIN6R) are single-ended inputs with an analog multiplexer.

Antialiasing low-pass filters are included on the these inputs to remove the out-of-band nose from the audio. If

the performance of these filters is not sufficient for a given application, appropriate external antialiasing filters are

required. The passive RC filter (see Figure 54) is used in general. Any pins that are not used in a given

application should be left open or connected to ground with a small, 0.1-

µF ceramic capacitor.

All line output pins (LO1L, LO1R, LO2L and LO2R) are single-ended outputs with a 2-VRMS driver. An amplifier

with a low-pass filter is not required as in a conventional DAC; however, the delta-sigma modulator generates

out-of-band noise. The passive RC filter (see Figure 55) is used to remove this noise in general. If any line output

pins are not used within a given application, they should be left open.

The headphone output pins (HPOL and HPOR) are single-ended outputs with more than 30-mW output power

into either a 16-

Ω or 32-Ω load. If the headphone output pins are not used within a given application, they should

be left open. Adding a small resistor to these outputs is recommended (see Figure 56). in order to protect the

application and device from short-circuiting.

A 1

µF ceramic capacitor should be connected between the common voltage pins (VCOMAD and VCOMDA) for

the analog circuit and ground to ensure low source impedance of the ADC and DAC common voltages. This

capacitor should be located as close as possible to these pins.

A 1-

µF ceramic capacitor should be connected between the VREFAD1 pin and ground to ensure low source

impedance of ADC reference voltage. This capacitor should be located as close as possible to these pins.

VREFAD2 pin should be connected to directly ground.

The audio interface pins (LRCKx, BCKx, SCKx), clock pins (SCKx) and general-purpose input/output (GPIOx)

pins change from input mode to output mode through register settings. In output mode, these pins have

adequate load drive capability (see the Electrical Characteristics); however, if the signal lines are long, placing a

buffer near the PCM5310 and minimizing the load capacitor is recommended in order to optimize crosstalk

between the digital and analog circuits, maximize the dynamic performance of the ADC and DAC, and reduce

overall power consumption. The digital output pins should be open if they are not used in a given application.

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