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MAC7200 Datasheet(PDF) 942 Page - Freescale Semiconductor, Inc |
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MAC7200 Datasheet(HTML) 942 Page - Freescale Semiconductor, Inc |
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942 / 976 page ![]() Power Dissipation and Thermal Characteristics MAC7200 Microcontroller Family Reference Manual, Rev. 2 864 Freescale Semiconductor The total power dissipation is calculated from: Eqn. A-2 Two cases must be considered for PINT: 1. Internal Voltage Regulator enabled: Eqn. A-3 2. Internal voltage regulator disabled (VDDR = VSSR = system ground): Eqn. A-4 PIO is the sum of all output currents on I/O ports associated with VDDX and VDDR.: Eqn. A-5 where Eqn. A-6 or Eqn. A-7 IDDR is the current shown in Table A-11 and not the overall current flowing into VDDR, which additionally contains the current flowing into the external loads with output high. A.5.1 Thermal Resistance Simulation Details Table A-8. Thermal Resistance for 100 lead 14x14 mm LQFP, 0.5 mm Pitch1 Rating Value Unit Junction to Ambient (Natural Convection)2, 3 Single layer board (1s) R θJA 55 °C/W Junction to Ambient (Natural Convection)2, 4 Four layer board (2s2p) R θJMA 42 °C/W Junction to Ambient (@ 200 ft./min.)2, 4 Single layer board (1s) R θJMA 45 °C/W Junction to Ambient (@ 200 ft./min.)2, 4 Four layer board (2s2p) R θJMA 36 °C/W Junction to Board5 R θJB 28 °C/W Junction to Case6 R θJC 11 °C/W Junction to Package Top7 Natural Convection ΨJT 2°C/W T J Junction Temperature ( °C) = T A Ambient Temperature ( °C) = P D Total Chip Power Dissipation (W) = Θ JA Package Thermal Resistance ( °C/W) = P D P INT P IO + = P INT Chip Internal Power Dissipation (W) = P IO Input / Output Power Dissipation (W) = P INT I DDRVDDR × () I DDAVDDA × () + = P INT I DD1.5 V DD1.5 × () I DD3.3 V DD3.3 × () I DDPLL V DDPLL × () I DDAVDDA × () ++ + = P IO R DSON i ∑ I IO i ()2 ⋅ = R DSON V OL I OL ---------- (for outputs driven low) = R DSON V DDXVOH – I OL -------------------------------- (for outputs driven high) = |
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