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OR4E2 Datasheet(PDF) 78 Page - Agere Systems |
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OR4E2 Datasheet(HTML) 78 Page - Agere Systems |
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78 / 124 page ![]() 78 Lucent Technologies Inc. Preliminary Data Sheet December 2000 ORCA Series 4 FPGAs Pin Information (continued) Package Compatibility Table 43 provides the number of user I/Os available for the ORCA Series 4 FPGAs for each available package. Each package has seven dedicated configuration pins. Table 44 through Table 46 provide the package pin and pin function for the ORCA Series 4 FPGAs and packages. The bond pad name is identified in the PIO nomenclature used in the ORCA Foundry design editor. When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects). When a package pin is to be left as a no connect for a specific die, it is indicated as a note in the device pad column for the FPGA. The tables provide no information on unused pads. Table 43. ORCA I/Os Summary Device 352 PBGA 432 EBGA 680 PBGAM1 OR4E2/OR4E4/OR4E6 User I/O Single Ended 262 306 466 Available Differential Pairs (LVDS, LVPECL) 128 150 196 Configuration 7 7 7 Dedicated Function 3 3 3 VDD15 16 40 48 VDD33 8 8 8 VDDIO 24 24 60 VSS 68 44 88 |
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