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OR4E2 Datasheet(PDF) 32 Page - Agere Systems |
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OR4E2 Datasheet(HTML) 32 Page - Agere Systems |
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32 / 124 page ![]() 32 32 Lucent Technologies Inc. Preliminary Data Sheet December 2000 ORCA Series 4 FPGAs Programmable Input/Output Cells (continued) On the output side of each PIO, an output from the PLC array can be routed to each output FF, and logic can be associated with each I/O pad. The output logic associ- ated with each pad allows for multiplexing of output sig- nals and other functions of two output signals. The output FF, in combination with output signal multi- plexing, is particularly useful for registering address signals to be multiplexed with data, allowing a full clock cycle for the data to propagate to the output. The out- put buffer signal can be inverted, and the 3-state con- trol can be made active-high, active-low, or always enabled. In addition, this 3-state signal can be regis- tered or nonregistered. The Series 4 I/O logic has been enhanced to include modes for speed uplink and downlink capabilities. These modes are supported through shift register logic which divides down incoming data rates or multiplies up outgoing data rates. This new logic block also sup- ports high-speed DDR mode requirements where data is clocked into and out of the I/O buffers on both edges of the clock. The new programmable I/O cell allows designers to select I/Os that meet many new communication stan- dards permitting the device to hook up directly without any external interface translation. They support tradi- tional FPGA standards as well as high-speed single- ended and differential pair signaling (as shown in Table 14). Based on a programmable, bank-oriented I/O ring architecture, designs can be implemented using 3.3 V, 2.5 V, 1.8 V, and 1.5 V output levels. Table 14. Series 4 Programmable I/O Standards Note: Interfaces to DDR and ZBT memories are supported through the interface standards shown above. Standard VDDIO (V) VREF (V) Interface Usage LVTTL 3.3 NA General purpose. LVCMOS2 2.5 NA LVCMOS1.8 1.8 NA PCI 3.3 NA PCI. LVDS 2.5 NA Point to point and multidrop backplanes, high noise immunity. Bused-LVDS 2.5 NA Network backplanes, high noise immunity, bus architecture backplanes. LVPECL 2.5 NA Network backplanes, differential 100 MHz+ clocking, optical transceiver, high-speed networking. PECL 3.3 2.0 Backplanes. GTL 3.3 0.8 Backplane or processor interface. GTL+ 3.3 1.0 HSTL-Class I 1.5 0.75 High-speed SRAM and networking interfaces. HTSL-Class III and IV 1.5 0.9 STTL3-Class I and II 3.3 1.5 Synchronous DRAM interface. SSTL2-Class I and II 2.5 1.25 |
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