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PXA270 Datasheet(PDF) 19 Page - Intel Corporation

Part # PXA270
Description  Electrical, Mechanical, and Thermal Specification
PDF  126 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

PXA270 Datasheet(HTML) 19 Page - Intel Corporation

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Electrical, Mechanical, and Thermal Specification
3-7
Intel® PXA270 Processor
Package Information
3.3
Junction To Case Temperature Thermal Resistance
3.4
Processor Markings
The diagram in this section details the processor’s top markings, which identify the PXA270
processor in the 356-ball VF-BGA and 360-ball PBGA package. Refer to Figure 3-4 for product
information. A Pb-Free (lead-free) package is indicated by the letter “E” on the 3rd line of
information (Intel legal line). The “E” appears after the date stamp.
Table 3-1. Processor Material Properties
Component
VF-BGA Material
PBGA Material
Mold compound
ShinEtsu KMC 2500 VAT1
Sumitomo G770LE
Solder balls
63 Sn/37 Pb†
63 Sn/37 Pb†
† Subsequent processor steppings may use Pb-free (94.5 Sn/5.0 Ag/ 0.5 Cu) balls.
Parameter
VF-BGA Value and Units
PBGA Value and Units
Theta Jc
2 degrees C / watt
1.4 degrees C / watt
Figure 3-10. Intel® PXA270 Processor Production Markings, (Laser Mark on Top Side)
g
Laser Mark on top side of Package
Product
Lot #
Intel Legal
i
PXA270C0C416
FPO#
M C ‘03
TAIWAN
PIN 1 INDICATOR
COO
g
Laser Mark on top side of Package
Product
Lot #
Intel Legal
i
PXA270C0C416
FPO#
M C ‘03
TAIWAN
PIN 1 INDICATOR
COO



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