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PXA270 Datasheet(PDF) 19 Page - Intel Corporation |
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PXA270 Datasheet(HTML) 19 Page - Intel Corporation |
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19 / 126 page ![]() Electrical, Mechanical, and Thermal Specification 3-7 Intel® PXA270 Processor Package Information 3.3 Junction To Case Temperature Thermal Resistance 3.4 Processor Markings The diagram in this section details the processor’s top markings, which identify the PXA270 processor in the 356-ball VF-BGA and 360-ball PBGA package. Refer to Figure 3-4 for product information. A Pb-Free (lead-free) package is indicated by the letter “E” on the 3rd line of information (Intel legal line). The “E” appears after the date stamp. Table 3-1. Processor Material Properties Component VF-BGA Material PBGA Material Mold compound ShinEtsu KMC 2500 VAT1 Sumitomo G770LE Solder balls 63 Sn/37 Pb† 63 Sn/37 Pb† † Subsequent processor steppings may use Pb-free (94.5 Sn/5.0 Ag/ 0.5 Cu) balls. Parameter VF-BGA Value and Units PBGA Value and Units Theta Jc 2 degrees C / watt 1.4 degrees C / watt Figure 3-10. Intel® PXA270 Processor Production Markings, (Laser Mark on Top Side) g Laser Mark on top side of Package Product Lot # Intel Legal i PXA270C0C416 FPO# M C ‘03 TAIWAN PIN 1 INDICATOR COO g Laser Mark on top side of Package Product Lot # Intel Legal i PXA270C0C416 FPO# M C ‘03 TAIWAN PIN 1 INDICATOR COO |
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