AS3900 datasheet(7/59 Pages) AMSCO

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AS3900

Data Sheet -

Absolute Maxim u m Rat i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and

functional operation of the device at these or any other conditions beyond those indicated in the Detailed Description are not implied. Exposure

to absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Unit

Note

DC supply voltage (VDD)-0.5

5.0

Input pin voltage(VIN)-0.5

5.0

Input current (latchup immunity) (Iscr)

-100

100

Norm: Jedec 78

ESD for digital pins (ESDD)

±2

Norm: MIL 883 E method 3015 (Human Body Model)

ESD for analog pins (ESDA)

±2.0

Norm: MIL 883 E method 3015 (Human Body Model)

ESD for RF pins (ESDRF)

±1.5

Norm: MIL 883 E method 3015 (Human Body Model)

Total power dissipation (Pt)

(all supplies and outputs)

TX: 8mA*3.6V=29mW

Storage temperature (Tstrg)

-55

125

ºC

Package body temperature (Tbody)

260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/JEDEC

J-STD-020C “Moisture/Reflow Sensitivity Classification

for Non-Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity non-condensing

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