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FXLS93421 Datasheet(PDF) 27 Page - NXP Semiconductors |
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FXLS93421 Datasheet(HTML) 27 Page - NXP Semiconductors |
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27 / 254 page  NXP Semiconductors FXLS9xxxx Dual channel inertial sensor 10.11 Dynamic electrical characteristics - DSI3 VBUS_I_L_min ≤ (VBUS_I – VSS) ≤ VBUS_I_H_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified # Characteristic Symbol Min Typ Max Units Test notes Command Reception (General) 10709 VHIGH low-pass filter time constant (Section 12.1.1) tVHIGH_RC 60 120 180 µs 7, 9 10722 VHIGH Detection Analog Delay (Section 12.1.1) tVHIGH_Delay — — 600 ns 7, 9 10721 Command Valid time (Section 12.1.1) tCmd_Valid — 2 — µs 7, 9 Response Transmission (General, Slew Control Enabled, Section 12.3.3) 10710 Response Slew Time: 2.0 mA to 10.0 mA, 10.0 mA to 2.0 mA tSLEW1_RESP 350 400 500 ns 1, 7, 9 10726 Response Slew Time: 4.0 mA to 20.0 mA, 20.0 mA to 4.0 mA tSLEW2_RESP 350 400 500 ns 1, 7, 9 10725 tSLEW1_RESP – tSLEW2_RESP ΔtSLEW –100 — 100 ns 7, 9 10724 tSLEW1_RESP_Rise – tSLEW2_RESP_Fall ΔtSLEW_rf –250 — 250 ns 7, 9 10723 Response Current Activation Time: Current Activated to 50 % tACT_RESP 200 — 400 ns 3, 7, 9 Response Transmission (General, Slew Control Disabled, Section 12.3.3) 10727 Response Slew Time: 2.0 mA to 10.0 mA, 10.0 mA to 2.0 mA tnSLEW1_RESP — — 300 ns 7, 9 10728 Response Slew Time: 4.0 mA to 20.0 mA, 20.0 mA to 4.0 mA tnSLEW2_RESP — — 300 ns 7, 9 10729 tSLEW1_RESP – tSLEW2_RESP ΔtnSLEW –300 — 300 ns 7, 9 10730 tSLEW1_RESP_Rise – tSLEW2_RESP_Fall ΔtnSLEW_rf –300 — 300 ns 7, 9 10731 Response Current Activation Time: Current Activated to 50 % tnACT_RESP — — 300 ns 7, 9 Command Reception (Discovery Mode) 10719 Command Start Time (Section 12.2) tSTART_DISC tPOR_DSI — 13.5 ms 7, 8, 9 10734 Command Bit Time (Section 12.2) tDISC_BitTime 14 16 18 µs 7, 8, 9 10733 Command Transmission Period (Section 12.2) tPER_DISC 125 — — µs 7, 8, 9 10732 Command Blocking Time, Discovery Mode (Section 12.1.1) tCmdBlock_DISC — 80 — µs 7, 8, 9 Response Transmission (Discovery Mode) 30078 Idle Current Sample Delay (Section 12.2) tDISC_DLY — 48 — µs 7, 8, 9 30079 Idle Current Sample Time (Section 12.2) tDISC_ICCQ_SAMP — 15 — µs 7, 8, 9 10718 Response Start Delay (Section 12.2) tSTART_DISC_RSP — 64 — µs 7, 8, 9 10738 Response Ramp Time (Section 12.2) tDISC_Ramp_RSP — 16 — µs 7, 8, 9 10737 Response Ramp Rate (Section 12.2) IDISC_Ramp — 1.5 — mA/µs 7, 8, 9 10736 Response Idle Time (Section 12.2) tDISC_Idle_RSP — 16 — µs 7, 8, 9 10735 Response Peak Current (Section 12.2) IDISC_Peak — 2*IRESP — mA 7, 8, 9 30081 Response Current Sample Delay (Section 12.2) tIDISC_Samp_Dly — 65 — µs 7, 8, 9 30080 Response Current Sample Time (Section 12.2) tIDISC_Samp — 31 — µs 7, 8, 9 Command Reception (Command and Response Mode) 10717 Command Bit Time (Section 12.3) tCmd_BitTime — 8 — µs 7, 8, 9 10741 Command Transmission Period (Section 12.3) tPER_CRM 475 — — µs 7, 8, 9 10740 Command Blocking Time, CRM (Section 12.1.1) tCmdBlock_CRM — 455 — µs 7, 8, 9 10739 Command Blocking Start Time, CRM (Section 12.1.1) tCmdBlock_ST_CRM — 290 — µs 7, 8, 9 Table 34. Dynamic electrical characteristics - DSI3 FXLS9xxxx All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 6 — 8 February 2021 27 / 254 |
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