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VNF9D5F Datasheet(PDF) 91 Page - STMicroelectronics |
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VNF9D5F Datasheet(HTML) 91 Page - STMicroelectronics |
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91 / 108 page ![]() Table 73. PCB properties Dimension Value Board finish thickness 1.6 mm ±10% Board dimension 129 mm x 60 mm Board material FR4 Cu thickness (top and bottom layers) 0.070 mm Cu thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal vias diameter 0.3 mm ±0.08 mm Cu thickness on vias 0.025 mm Footprint dimension (top layer) 6 mm x 6 mm Heatsink copper area dimension (bottom layer) Footprint, 2 cm2 or 8 cm2 Figure 47. RthJA vs PCB copper area in open box free air conditions PCB Cu heatsink area (cm2 ) RthJA (°C/W) 30 35 40 45 50 55 60 0 2 4 6 8 10 RthJA on 4Layers PCB: 21.8 °C/W RthJB: 6.5 °C/W VNF9D5F Package and PCB thermal data DS13946 - Rev 8 page 91/108 |
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